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EERE » BTO » Building America » Solution Center Home » Research Tracker » Next-Generation LED Package Architectures Enabled by Thermally Conductive Transparent Encapsulants

Next-Generation LED Package Architectures Enabled by Thermally Conductive Transparent Encapsulants

Momentive will develop next-generation LED package architectures enabled by thermally conductive composite encapsulant materials. These LED package architectures could provide more-efficient lighting options for use in U.S. buildings.
http://energy.gov/eere/buildings/downloads/next-generation-led-package-architec…
Scope
Funded Performer
Momentive
Agreement Total
$1,497,255
Match Total
$512,700
Project Start Date
Project End Date
Program Information
Funding Organization
Department of Energy
Program Area
Emerging Technologies
Project Manager
Jim Brodrick
Agreement Type
Funding Opportunity
Project Details
Ongoing Initiative or Research Project
Research Project
Grid, Whole Building, or Technology
Technology
Technology Type
Lighting
Building Type
Commercial
New or Existing
New
Existing
DR Focus?
No
Code/Standard Focus?
No
Locale
City
Strongsville
State
Ohio