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Adhesive Bonding of Aluminum and Copper in HVAC&R Applications

Oak Ridge National Lab (ORNL), with its partner 3M, is developing adhesive chemistries for bonding aluminum and copper during heat exchanger manufacture, resulting in enhanced bonding and significant energy savings.

Program Information
Funding Organization: 
Department of Energy
Program Area: 
Emerging Technologies
Project Manager: 
Tony Bouza
Agreement Type: 
Funding Opportunity
Scope
Funded Performer: 
Oak Ridge National Laboratory
Partners (not funded): 
3M
Agreement Total: 
$1,500,000
Match Total: 
$167,000
Project Start Date: 
December 31, 2015
Project End Date: 
December 30, 2019
Project Details
Ongoing Initiative or Research Project: 
Research Project
Grid, Whole Building, or Technology: 
Technology
Technology Type: 
HVAC
Sub-Technology Type: 
HVAC - Installation
Building Type: 
Single Family, Multifamily, Commercial
New or Existing: 
New, Existing
DR Focus?: 
No
Code/Standard Focus?: 
No
Locale
City: 
Oak Ridge
State: 
Tennessee